American Semiconductor & Bayflex Expand Hybrid Electronics Testing

At the WT Conference in Mountain View, American Semiconductor and Bayflex Solutions announced an expansion of their domestic testing infrastructure for flexible hybrid electronics (FHE). 

Under this expanded partnership, American Semiconductor will broaden its testing facilities to meet demand across the global electronics, defense, wearable, and medical device sectors for advanced materials, components, and connected systems.

This announcement represents the next milestone in a long-running, American-led technical alliance between the two companies. 

The expansion initiatives will commence immediately, with the integrated testing cells scheduled to be fully deployed and accessible to commercial partners by early 2027.

To equip the expanded facility, Bayflex Solutions will double its previous contribution of high-performance automated thermo-mechanical testing equipment.

This deployment introduces specialized in-situ torsion and bending systems engineered to evaluate devices under extreme, hostile environmental conditions.

These systems combine multi-channel electronic data acquisition with integrated optical inspection, providing real-time optical tracking and electrical characterization of device degradation and fatigue under continuous mechanical stress.

“Expanding our facilities directly addresses the urgent, rigorous reliability requirements of our global electronics, defense, and healthcare partners,” said Doug Hackler, CEO of American Semiconductor. “Integrating Bayflex’s cutting-edge thermo-mechanical test platforms enables us to provide our partners with unparalleled empirical insight into device longevity, packaging integrity, and performance under extreme operational conditions.”

“Doubling our equipment footprint with American Semiconductor marks an exciting step forward in domestic FHE commercialization,” said Eisuke Tsuyuzaki of Bayflex Solutions. “Our automated in-situ bending and torsion testers—paired with synchronous multi-channel data collection and optical inspection—eliminate testing bottlenecks and give engineering teams the exact mechanical and electrical validation required to bring critical defense, wearable, and medical components safely to market.”